ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,808, issued on April 21, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan). "Semiconductor structure including in... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,809, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interconnection structure lined b... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,810, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and m... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,811, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure, test structure, ... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,812, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure, fabrication meth... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,813, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interconnect structure including ... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,814, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Electronic fuse device including fuse gate, pa... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,815, issued on April 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Bond wire reliability and process with high thermal performance... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,816, issued on April 21, was assigned to DOWA METALTECH Co. LTD. (Tokyo). "Insulating substrate and manufacturing method thereof" was inve... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,817, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Metal matrix composite layers for heat dissipation from integ... Read More